Bump formation inspection device
Applied lighting structure to minimize over-detection and under-detection! A variety of types have been lined up.
Introducing a bump inspection machine equipped with multi-lighting technology. In defect detection through MULTI lighting combination technology, the lighting structure is applied to minimize over-detection and under-detection. It inspects all layers of PCB products on CAM Master Data, allowing parameter input and reducing setup time. 【CAM MASTER Technology】 ■ Inspects all layers of PCB products on CAM Master Data Parameter input available, setup time reduced ■ Immediate confirmation of detection through manual inspection based on inspection SPEC inputted into CAM Master ■ All complex areas such as metal regions, S regions, and via hole areas are automatically categorized for inspection progress *For more details, please refer to the PDF document or feel free to contact us.
- Company：ラットコーポレーション 本社：営業部・業務部
- Price：Other
